Sputtering

Sputtering is a technique for depositing a variety of materials onto a substrate. This is achieved by bombarding a material with argon causing the atoms on the surface of the material to vaporize and coating everything inside the vacuum chamber. This technique can deposit materials at a rate of up to 0.1 [nm/s].

AJA ATC-2200

DescriptionSpecification
Sample Size3" Wafer or
4" Wafer or
Custom Size
Deposition Uniformity2% across 3" Wafer
Guns6
Target MaterialAu, Co, Cr, Cu, W
Target Dimension2" Diameter x 1/4" Tall
DC Power0 to 500 [W]
RF Power0 to 250 [W]
Sample Bias RF Power0 to 50 [W]
GasAr, O2, N2
Base Pressure5x10-8 [Torr]

Core Technology

Core TechnologyDescription
SOP: AJA ATC-2200This document is the standard operating procedure (SOP) for the AJA ATC-2200 ultra high vacuum sputtering system at UHNF. This SOP serves as a foundation for initial training and ensures that the equipment can be operated correctly, by everyone, the first time.
Base PressureThe base pressure is an important process parameter. The trace gases are characterized for the AJA ATC-2200.
UniformityThe deposition uniformity is an important process parameter to control to ensure homogenous material properties across an entire wafer. The uniformity depends on the gun angle, gun position and throw distance. The uniformity is characterized for the AJA ATC-2200.
System GeometryThe system geometry provides a path towards modeling the deposition uniformity and rates.
Deposition RateWe recommend every operator to calibrate the deposition rate each time their target is installed. This guide provides long term data of the deposition rate on the AJA ATC-2200.
SSP: AJA ATC-2200This document is the standard service procedure (SSP) for the AJA ATC-2200 ultra high vacuum sputtering system at UHNF. This SSP ensures that any staff can effectively perform routine service or repairs correctly, the first time. This document is restricted to equipment custodians. Contact us for access.

Guide

GuideDescription
Process DevelopmentLearn how to develop a robust sputtering process and contribute towards making nanofabrication technology more accessible.
Sputtering TargetsLearn about sputtering targets and the material cost of sputtering
Seed LayerLearn about the importance of seed layers
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