Rapid Thermal Processor

Electron beam lithography is a technique capable of producing patterns minimum features below 10 [nm]. This is achieved by focusing a beam of electrons into a tiny spot and scanning the beam to expose a pattern on a electron sensitive media. The exposed pattern produces structural contrast in the media after development. Electron beam lithography can be performed using a scanning electron microscope, but it is typically better to use an electron beam writer which is designed to provide faster print speed with higher resolution while requiring significantly less training.

Allwin AW 410

DescriptionSpecification
Sample Size100 [mm] Wafer or
75 [mm] Wafer or
Custom Size
Temperature0 to 1000 [°C]
Temperature Repeatability± 0.5 [°C]
Temperature Uniformity< 5 [°C]
Ramp Up Rate10 to 200 [°C/s]
Ramp Down Rate10 to 250 [°C/s]
GasAir, Ar, O2, N2
Equipment_RTP_A
Equipment_RTP_Header

Core Technology

Core TechnologyDescription
SOP: Accuthermo AW410This document is the standard operating procedure (SOP) for the Allwin21 Accuthermo AW410 rapid thermal processor at UHNF. This SOP serves as a foundation for initial training and ensures that the equipment can be operated correctly, by everyone, the first time.
SSP: Accuthermo AW410This document is the standard service procedure (SSP) for the Allwin21 Accuthermo AW410 rapid thermal processor at UHNF. This SSP ensures that any staff can effectively perform routine service or repairs correctly, the first time. This document is restricted to equipment custodians. Contact us for access.
Maximum Process TimeThe maximum process time for the Allwin21 Accuthermo AW410 varies with temperature. The process time is not limited for temperatures up to 650 [°C]. At higher temperatures, the process time decreases rapidly to 80 [s] at 1050 [°C].

Guide

GuideDescription